The Major Factors in Designing a Paper Leadframe are the Size, Thickness, Holes & Design to eliminate Mold Bleed.
The Size: Length, Width and Thickness; Our experience has taught us what are the desired tolerances given to the size, we know the right thickness to compensate for the softer paper material.
The Number of Paper Layer for this Thickness; The price of 2 or 3 layers is many times more expensive than one layer. Multiple layers are required to be attached by special adhesive, curing and pressing processes.
The Location Holes and Through Holes; The locating holes are needed to locate the Paper Leadframe to the bottom mold accurately, we design exclusively for some locations of through holes as to enhance the mold flow and eliminate the warpage stress.
Special Design to Eliminate Mold Bleed; We are the few of the specialised Paper Leadframe supplier to provide not only a lower sustainable material cost but also solution to resolve mold bleed delivered by Copper Leadframe or PCB Substrate.
For more details, email sales@Skymart-Group.com or click SKYMART